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Brand Name : ZMSH
Model Number : silicon wafer
Place of Origin : China
Type/Dopant : N - Phos/Sb/As
Orientation : 100
Resistivity : 0-100 ohm-cm
Thickness : 381μm/525μm/625μm +/- 20μm
TTV : < 10μm
Flats : 1 or 2/ SEMI standard
polish : single side polish
Particle (LPD) : <=20@>=0.3um
Silicon wafer N type P Dopant 2inch 4inch 6inch 8inch Resistivity: 0-100 ohm-cm Single side polished
Silicon wafers are thin slices of semiconductor material, predominantly silicon, used as the substrate in the manufacture of integrated circuits (ICs) and other microelectronic devices. These wafers are derived from single-crystal silicon ingots, which are grown using methods such as the Czochralski (CZ) process. The ingots are then sliced into wafers, polished to achieve a mirror-smooth surface, and further processed based on specific industry requirements.
Silicon wafers are integral to the semiconductor industry, exhibiting a range of properties that make them ideally suited for electronic and photonic device fabrication. Here are the key properties of silicon wafers:
Electrical Properties:
Mechanical Properties:
Thermal Properties:
Optical Properties:
Chemical Properties:
Diameter: 76mm/100mm/125mm | Diameter: 200mm | Diameter: 300mm |
---|---|---|
Silicon Wafer | Silicon Wafer | Silicon Wafer |
Type/Dopant: N - Phos/Sb/As | Type/Dopant: N - Phos/Sb/As | Type/Dopant: N - Phos/Sb/As |
Orientation: <100> | Orientation: <100> | Orientation: <100> |
Resistivity: 0-100 ohm-cm | Resistivity: 0-100 ohm-cm | Resistivity: 0-100 ohm-cm |
Thickness: 381μm/525μm/625μm +/- 20μm | Thickness: 725μm +/- 20μm | Thickness: 775μm +/- 20μm |
TTV: < 10μm | TTV: < 5μm | TTV: < 5μm |
Flats: 1 or 2/ SEMI standard | Notch: SEMI standard | Notch: SEMI standard |
Single side polished | Single side polished | Double side polished |
Particle (LPD): <=20@>=0.3um | Particle (LPD): <=50@>=0.2um | Particle (LPD): <=50@>=0.2um |
These properties are leveraged during the semiconductor device fabrication process, where precise control over electrical, mechanical, and chemical characteristics is required to produce reliable and high-performance electronic components. The adaptability of silicon wafers to various doping processes further enhances their utility in creating a wide range of electronic and photonic devices.
Silicon wafers, due to their versatile properties and compatibility with various manufacturing technologies, find application across numerous industries. Here’s how these applications are generally categorized:
Integrated Circuits (ICs):
Solar Energy:
Microelectromechanical Systems (MEMS):
Optoelectronics:
Power Electronics:
Semiconductor Lasers:
Quantum Computing:
Each of these applications leverages the unique electrical, thermal, mechanical, and optical properties of silicon wafers to fulfill specific functional requirements. The ongoing development and scaling down of silicon technology continue to open new possibilities and enhance existing capabilities across these diverse fields.
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Silicon Wafer N Type P Dopant 2inch 4inch 6inch 8inch Resistivity 0-100 Ohm-cm Single Side Polished Images |